Auflistung nach Schlagwort "condition monitoring"

Sortiert nach: Sortierung: Ergebnisse:

  • Hinrichs, Reemt; Schmidt, Alexander; Koslowski, Julian; Bergmann, Benjamin; Denkena, Berend; Ostermann, Jörn (Amsterdam [u.a.] : Elsevier, 2021)
    The overall equipment effectiveness (OEE) is a management ratio to evaluate the added value of machine tools. Unplanned machine downtime reduces the operational availability and therefore, the OEE. Increased machine costs ...
  • Herwig, Daniel (Hannover : Institutionelles Repositorium der Leibniz Universität Hannover, 2023)
    Temperature-sensitive electrical parameters (TSEPs) can be used to monitor the condition of unmodified power modules or to measure the virtual junction temperature of a semiconductor. The measurement of TSEPs on fast-switching ...
  • Schneider, Volker; Behrendt, Cara; Höltje, Pauline; Cornel, Daniel; Becker-Dombrowsky, Florian Michael; Puchtler, Steffen; Gutiérrez Guzmán, Francisco; Ponick, Bernd; Jacobs, Georg; Kirchner, Eckhard (Basel : MDPI, 2022)
    Rolling bearings face different damaging effects: Besides mechanical effects, current-induced bearing damage occurs in electrical drive systems. Therefore, it is of increasing interest to understand the differences leading ...
  • Wolf, Alexander (Basel : MDPI, 2023)
    In this paper, a novel optical measurement principle for deformation, especially torsion, is presented. A laser beam is guided via total internal reflection (TIR) in a prism rod. Every single reflection causes an increasing ...
  • Denkena, Berend; Dahlmann, Dominik; Kiesner, Johann (Amsterdam : Elsevier, 2016)
    Clamping errors in workpiece positioning decrease the production outcome of machine tools by causing rejects. An automated monitoring of these failures does not take place in practice, due to limited installation space for ...
  • Denkena, Berend; Dahlmann, Dominik; Kiesner, Johann (Amsterdam : Elsevier, 2014)
    Failures in workpiece positioning influence the machining conditions and outcome of machine tools directly. Hence, the monitoring by a sensor integrated clamping system to avoid rejects is subject of the presented work. ...